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Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations

Zhou, Jianguo
http://rave.ohiolink.edu/etdc/view?acc_num=akron1176968256

Abstract Details

2007, Doctor of Philosophy, University of Akron, Polymer Engineering.
Epoxy/Ni adhesives can be used as integrated circuit (IC) packaging materials due to their lower cost than epoxy/Ag adhesives with acceptable electrical conductivity. In this study, epoxy/Ni adhesives were prepared and filled into multi-layer hole structures of novel design, a prototype of potential electronic components in circuit boards, to study effects of the hole structure geometry on a component’s electrical resistance. An empirical relationship between the contact resistance, hole diameter, and plate thickness was proposed, together with Ohm’s law, to describe effects of the geometry on electrical resistance in generic circuits. Stable and unstable capillary flows of highly filled epoxy/Ni suspensions, chemorheological behaviors, and yield behaviors of moderately filled epoxy/Ni suspensions, were also investigated to potentially relate to electrical conduction behaviors and processing of prototypes in generic circuits. Lower resin viscosity and shear rates enhance the flow instabilities and polymer binder filtering, and incorporation of Ni nanopowders promotes a stable flow, whereas occurrence of particle agglomerates somewhat nullifies this advantage. Similar phenomena occur for adhesives during cure, and the rheological behavior changes as cure proceeds. Additionally, strong nonlinearity and non-Newtonian flow behaviors were observed during cure. A comprehensive model, as well as its modified form, was proposed to describe the combined effects of the shear rate, resin conversion, filler volume fraction, and temperature on chemoviscosity. Yield behaviors of moderately filled epoxy/Ni suspensions were studied as well. Effects of the preshear, resin viscosity, temperature, particle size, as well as different methods for yield stress determination, were examined. Finally, the shear degradation of epoxy/Ni adhesives during cure was discussed.
Erol Sancaktar (Advisor)
211 p.
Generic Circuits; Epoxy/Ni Conductive Adhesives; Geometry Effects; Rheological Behaviors

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Citations

  • Zhou, J. (2007). Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations [Doctoral dissertation, University of Akron]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=akron1176968256

    APA Style (7th edition)

  • Zhou, Jianguo. Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations. 2007. University of Akron, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=akron1176968256.

    MLA Style (8th edition)

  • Zhou, Jianguo. "Processing of Generic Circuits by Conductive Adhesives: Geometrical and Rheological Considerations." Doctoral dissertation, University of Akron, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=akron1176968256

    Chicago Manual of Style (17th edition)

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© 2007, all rights reserved.
This open access ETD is published by University of Akron and OhioLINK.