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Modeling, Simulations, and Parametric Studies of the Dip Coating Process with the Effect of Solvent Evaporation Rate and Bulk Reaction Rate

Jittavanich, Kotchanun
http://rave.ohiolink.edu/etdc/view?acc_num=akron1222359806

Abstract Details

2008, Master of Science, University of Akron, Applied Mathematics.
In this paper we study the dip coating problem. We present a thin film model based on the lubrication approximation that includes an evaporation effect of the solvent and the bulk reaction effect of erbium oxide to determine the thickness of the coatings. We solve the problem numerically with the modified two-step Lax-Wendroff scheme [1]. While the two main mechanisms influencing the final film thickness are the solvent evaporation rate and the erbium oxide reaction, we also study how the dynamic viscosity, the angle of the inclined substrate, the characteristic depth of the solution thickness, the initial profile of the solution thickness, and the length of substrate affect the coating thickness. The developed model can be used in many coating industries to predict the coating thickness and approximate drying time
Gerald Young (Advisor)
Curtis Clemons (Advisor)
Kevin Kreider (Advisor)
effect; thickness of the coatings

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Citations

  • Jittavanich, K. (2008). Modeling, Simulations, and Parametric Studies of the Dip Coating Process with the Effect of Solvent Evaporation Rate and Bulk Reaction Rate [Master's thesis, University of Akron]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=akron1222359806

    APA Style (7th edition)

  • Jittavanich, Kotchanun. Modeling, Simulations, and Parametric Studies of the Dip Coating Process with the Effect of Solvent Evaporation Rate and Bulk Reaction Rate. 2008. University of Akron, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=akron1222359806.

    MLA Style (8th edition)

  • Jittavanich, Kotchanun. "Modeling, Simulations, and Parametric Studies of the Dip Coating Process with the Effect of Solvent Evaporation Rate and Bulk Reaction Rate." Master's thesis, University of Akron, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=akron1222359806

    Chicago Manual of Style (17th edition)

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© 2008, all rights reserved.
This open access ETD is published by University of Akron and OhioLINK.