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AAdhikari_Thesis_July_8_2019.pdf (1.29 MB)

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Polymer Matrix Composite: Thermally Conductive Greases Preparation and Characterization

Adhikari, Amit
http://rave.ohiolink.edu/etdc/view?acc_num=akron1556282222035491

Abstract Details

2019, Master of Science, University of Akron, Chemical Engineering.
The next generation electronic devices are expected to be small in size and of magnified capacity. Denser packaging of the active components is important to miniaturize the electronic devices. Denser packaging is feasible only when heat generated by heat sources is quickly and effectively carried away to the heat sink. Next generation electronic devices with high performance microprocessors and integrated circuits along with diminished volume have led to major heat dissipation issue. Heat dissipation helps to control the temperature of the electronic devices at a desired level. Heat is dissipated to the heat sink from heat generator by the process of thermal conduction. Due to irregularities on the surfaces of the heat generator and heat sink, air is entrapped, and the air gap is formed in the path of thermal conduction. Air gap disturbs the thermal conduction as air is a really poor thermal conductor with a thermal conductivity of 0.026 W/mK at room temperature. Air acts as a thermal barrier preventing the effective heat transfer between the heat source and heat sink. Different kind of thermal interface materials are used to fill up the air gap between the heat generator and the heat sink to improve thermal conduction. Introduction of thermal interface material can significantly increase the performance of electronic device. In a typical power electronic package, a grease is used as thermal interface material. Thermal conductive paste with high thermal conductivity (much greater than air) fills up all the air gaps between the heat generator and the heat sink to improve the thermal conduction. Development of the thermal conductive paste with low thermal resistance, high thermal conductivity and low electric conductivity is challenging and the most important aspect in today’s electronic industries. In the current study, we have tried to overcome this challenge by developing a thermally conductive grease with low thermal resistance, high thermal conductivity and low electric conductivity.
Jiahua Zhu , PhD (Advisor)
Rajeev Gupta , PhD (Committee Member)
Zhenmeng Peng, PhD (Committee Member)
67 p.
Chemical Engineering; Engineering; Polymers
Thermal Conductivity; Electric Conductivity; Viscosity; Thermal Interface Material; Thermally Conductive Grease; Boron Nitride; Graphite; Alumina

Recommended Citations

Citations

  • Adhikari, A. (2019). Polymer Matrix Composite: Thermally Conductive Greases Preparation and Characterization [Master's thesis, University of Akron]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=akron1556282222035491

    APA Style (7th edition)

  • Adhikari, Amit . Polymer Matrix Composite: Thermally Conductive Greases Preparation and Characterization. 2019. University of Akron, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=akron1556282222035491.

    MLA Style (8th edition)

  • Adhikari, Amit . "Polymer Matrix Composite: Thermally Conductive Greases Preparation and Characterization." Master's thesis, University of Akron, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=akron1556282222035491

    Chicago Manual of Style (17th edition)

akron1556282222035491
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This open access ETD is published by University of Akron and OhioLINK.