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Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications

Ongkodjojo Ong, Andojo
http://rave.ohiolink.edu/etdc/view?acc_num=case1354638816

Abstract Details

2013, Doctor of Philosophy, Case Western Reserve University, EECS - Electrical Engineering.
This work demonstrates an innovative microfabricated air cooling technology that employs an electrohydrodynamic (EHD) corona discharge or ionic wind pump that has the potential to meet industry requirements as a next generation solution for thermal management applications. A single ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. A grid structure on the collector electrodes enhances the overall heat transfer coefficient and facilitates an IC compatible and batch process. The main purpose of the work presented here is thus to investigate whether an optimized ionic wind pump employed in an array configuration might exhibit performance comparable to a conventional CPU fan. The manufacturing procedure developed for the device uses a glass wafer, a single mask-based photolithography process, a low cost copper-based electroplating method, and explores the effect of employing a palladium coating on the device. Various design configurations and optimization processes were explored and modeled computationally to investigate their influence on the cooling phenomenon. The optimized single element device provides a convection heat transfer coefficient of up to 3200 W/m2-K and a COP of up to 46.7 (a maximum COP of 51.5 exhibited by the 6-element array) exhibiting an overall area of 5.35 mm x 3.61 mm, an emitter-to-collector gap of 500 ¿¿m, and an emitter radius curvature of 12.5 ¿¿m. When compared with other ionic wind pumps, the device developed for this work is superior in terms of heat transfer coefficient and COP. However, the overall performance of the array does not compare favorably to a conventional CPU fan except in terms of COP. Additionally, the lifetime experiments conducted demonstrate that additional work may be required to extend the operation of the device, and some form of non-porous coating may be required to protect the underlying copper material. Nonetheless, the device described herein exhibits a flexible and small form factor, low noise generation, high efficiency, large heat removal over a small dimension, relatively simple technology, high reliability (no moving parts), lower power consumptions, and low cost; these are characteristics required by the semiconductor industry for next generation thermal management solutions.
Alexis Abramson, PhD (Advisor)
Norman Tien, PhD (Committee Member)
Christian Zorman, PhD (Committee Member)
Jaikrishnan Kadambi, PhD (Committee Member)
191 p.
Design; Electrical Engineering; Electromagnetics; Energy; Engineering; Experiments; Fluid Dynamics; Materials Science; Mechanical Engineering; Physics; Plasma Physics; Solid State Physics; Systems Design; Theoretical Physics
ionic wind pumps; thermal management; MEMS; electronics cooling; corona discharge; electrohydrodynamics; heat transfer coefficients; coefficient of performance (COP); FEM/FEA; optimization; lifetime test; microfabrication process

Recommended Citations

Citations

  • Ongkodjojo Ong, A. (2013). Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications [Doctoral dissertation, Case Western Reserve University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=case1354638816

    APA Style (7th edition)

  • Ongkodjojo Ong, Andojo. Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications. 2013. Case Western Reserve University, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=case1354638816.

    MLA Style (8th edition)

  • Ongkodjojo Ong, Andojo. "Electrohydrodynamic Microfabricated Ionic Wind Pumps for Electronics Cooling Applications." Doctoral dissertation, Case Western Reserve University, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=case1354638816

    Chicago Manual of Style (17th edition)

case1354638816
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© 2012, all rights reserved.
This open access ETD is published by Case Western Reserve University School of Graduate Studies and OhioLINK.