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Contactless Radio Frequency Probes for High Temperature Characterization of Microwave Integrated Circuits

Jordan, Jennifer L

Abstract Details

2014, Master of Sciences (Engineering), Case Western Reserve University, EECS - Electrical Engineering.
A method of characterizing microwave integrated circuits (MICs) at high temperature by way of a contactless probing method is developed. Current methods for characterizing MICs include probing circuits use either ground-signal-ground (GSG) or ground-signal (GS) contact probes that are not designed to withstand exposure to high temperatures. Although specially made GSG and GS probes for high temperature use have been developed, they lack the robustness for repeated use and often damage the device under test (DUT). A contactless approach was developed to address these limitations. In this work, a contactless probe design based on a microstrip transmission line that electromagnetically couples RF signals to a second microstrip transmission line connected in series to DUT was developed. To verify the efficacy of these contactless RF probes at high temperatures, three different circuits were designed, fabricated, and characterized at temperatures from 25 to 200 degrees C.
Christian Zorman, Ph.D. (Advisor)
70 p.

Recommended Citations

Citations

  • Jordan, J. L. (2014). Contactless Radio Frequency Probes for High Temperature Characterization of Microwave Integrated Circuits [Master's thesis, Case Western Reserve University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=case1402066531

    APA Style (7th edition)

  • Jordan, Jennifer. Contactless Radio Frequency Probes for High Temperature Characterization of Microwave Integrated Circuits. 2014. Case Western Reserve University, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=case1402066531.

    MLA Style (8th edition)

  • Jordan, Jennifer. "Contactless Radio Frequency Probes for High Temperature Characterization of Microwave Integrated Circuits." Master's thesis, Case Western Reserve University, 2014. http://rave.ohiolink.edu/etdc/view?acc_num=case1402066531

    Chicago Manual of Style (17th edition)