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THE DEVELOPMENT AND CHARACTERIZATION OF NON-LINEAR ROUTING WIRE BONDING PROCESS FOR HIGH-DENSITY CUFF ELECTRODE CONNECTOR

Xu, Yueshuo
http://rave.ohiolink.edu/etdc/view?acc_num=case1416583475

Abstract Details

2015, Master of Sciences (Engineering), Case Western Reserve University, Biomedical Engineering.
Implantable interconnect systems have been used in the application of neural interfaces to bridge electrode contacts and larger discrete wires. A robust interconnect system should conduct electrical signals while serving as a mechanical buffer between flexible nerve electrodes and bulky discrete wire bundles near the implantation site. An interconnect system was designed with microwire helices around strain-relief silicone tubing as an alternative approach to discrete in-line connectors and high-density thin film interconnects. Design criteria were designed based on short and long-term mechanical reliability for the device. The helical structure achieves a lower channel resistance compared to thin film traces. In addition, it can withstand short-term mechanical loads as well as 1.2 million cycles of 5% axial strain. This electronic interface can be applied to any implantable electronic system that requires metallic interconnects, which in the future will become useful for the development of human-machine interfaces.
Tyler Dustin , Dr. (Committee Chair)
Christian Zorman, Dr. (Committee Member)
John Lewandowski, Dr. (Committee Member)
85 p.
Biomedical Engineering
neural implant design; interconnect system; reliability testing

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Citations

  • Xu, Y. (2015). THE DEVELOPMENT AND CHARACTERIZATION OF NON-LINEAR ROUTING WIRE BONDING PROCESS FOR HIGH-DENSITY CUFF ELECTRODE CONNECTOR [Master's thesis, Case Western Reserve University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=case1416583475

    APA Style (7th edition)

  • Xu, Yueshuo. THE DEVELOPMENT AND CHARACTERIZATION OF NON-LINEAR ROUTING WIRE BONDING PROCESS FOR HIGH-DENSITY CUFF ELECTRODE CONNECTOR. 2015. Case Western Reserve University, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=case1416583475.

    MLA Style (8th edition)

  • Xu, Yueshuo. "THE DEVELOPMENT AND CHARACTERIZATION OF NON-LINEAR ROUTING WIRE BONDING PROCESS FOR HIGH-DENSITY CUFF ELECTRODE CONNECTOR." Master's thesis, Case Western Reserve University, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=case1416583475

    Chicago Manual of Style (17th edition)

case1416583475
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© 2014, all rights reserved.
This open access ETD is published by Case Western Reserve University School of Graduate Studies and OhioLINK.