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dayton1324051784.pdf (4.17 MB)
ETD Abstract Container
Abstract Header
Structurally Integrated Embedded System
Author Info
Zeppettella, David L.
Permalink:
http://rave.ohiolink.edu/etdc/view?acc_num=dayton1324051784
Abstract Details
Year and Degree
2011, Master of Science (M.S.), University of Dayton, Electrical Engineering.
Abstract
New additive manufacturing techniques such as Direct Write, combined with the continually decreasing size of electronic components have opened new application areas. One such application is the integration of electronic systems with an aircraft’s mechanical structure for the purpose of monitoring structural health and sensing the aerodynamic conditions surrounding the vehicle. Data from such a system could be provided to a flight control system to enable new control algorithms to address conditions such as gust loads or simply to improve fuel efficiency through minute attitude adjustments. This paper investigates structural integration techniques and demonstrates through laboratory experiments that the concept is feasible.
Committee
John G Weber, PhD (Advisor)
John S Loomis, PhD (Committee Member)
Ralph Barrera, DE (Committee Member)
Pages
95 p.
Subject Headings
Electrical Engineering
;
Engineering
Keywords
structural electronics
;
Fly by Feel
;
Direct Write
;
SHM
;
durability of electronics
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Citations
Zeppettella, D. L. (2011).
Structurally Integrated Embedded System
[Master's thesis, University of Dayton]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1324051784
APA Style (7th edition)
Zeppettella, David.
Structurally Integrated Embedded System.
2011. University of Dayton, Master's thesis.
OhioLINK Electronic Theses and Dissertations Center
, http://rave.ohiolink.edu/etdc/view?acc_num=dayton1324051784.
MLA Style (8th edition)
Zeppettella, David. "Structurally Integrated Embedded System." Master's thesis, University of Dayton, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1324051784
Chicago Manual of Style (17th edition)
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Document number:
dayton1324051784
Download Count:
1,218
Copyright Info
© 2011, all rights reserved.
This open access ETD is published by University of Dayton and OhioLINK.