Skip to Main Content
 

Global Search Box

 
 
 

ETD Abstract Container

Abstract Header

Wafer-Level Vacuum-Encapsulated Ultra-Low Voltage Tuning Fork MEMS Resonator

Huan, Junjun
http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493253273171541

Abstract Details

2017, Master of Science (M.S.), University of Dayton, Electrical Engineering.
In this thesis, a low-voltage 32 kHz silicon tuning fork MicroElectroMechanical Systems (MEMS)-based resonator design with a high Quality factor of over 73,000 is presented with a Complementary Metal-Oxide Semiconductor (CMOS) sustaining amplifier towards a low power oscillator. The resonator is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process developed by Teledyne DALSA Semiconductor Inc. (TDSI). MIDIS offers wafer-level vacuum encapsulation with ultra-low leak rate. Ultra-low polarization voltage, as low as 10mV, is needed to excite the resonator by using a transduction gap reduction technique based on electrostatic deflection of movable electrodes and subsequent localized melting of welding pads for permanent position locking. Further, the technique helps to minimize unexpected electrostatic stiffness induced by time-varying capacitance across transduction gaps to just -0.6 N/m. The motional resistance drops down to about 2kΩ as a result of a small gap size and the technique helps to improve the Quality Factor (Q). A sustaining amplifier using a transimpedance operational amplifier configuration is system-integrated with the tuning fork resonator to establish continuous oscillation with low damping losses. An average power consumption of around 600µW is measured on the oscillator, which is suitable for mobile electronic systems.
Vamsy Chodavarapu (Committee Chair)
Guru Subramanyam (Committee Member)
Weisong Wang (Committee Member)
64 p.
Electrical Engineering
MEMS-based tuning fork resonator, MIDIS process, 32 kHz oscillator circuit, transduction gap reduction technology

Recommended Citations

Citations

  • Huan, J. (2017). Wafer-Level Vacuum-Encapsulated Ultra-Low Voltage Tuning Fork MEMS Resonator [Master's thesis, University of Dayton]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493253273171541

    APA Style (7th edition)

  • Huan, Junjun. Wafer-Level Vacuum-Encapsulated Ultra-Low Voltage Tuning Fork MEMS Resonator. 2017. University of Dayton, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493253273171541.

    MLA Style (8th edition)

  • Huan, Junjun. "Wafer-Level Vacuum-Encapsulated Ultra-Low Voltage Tuning Fork MEMS Resonator." Master's thesis, University of Dayton, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1493253273171541

    Chicago Manual of Style (17th edition)

dayton1493253273171541
751
© 2017, all rights reserved.
This open access ETD is published by University of Dayton and OhioLINK.