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Design and Analysis of Wafer-Level Vacuum-Encapsulated Disk Resonator Gyroscope Using a Commercial MEMS Process

Uppalapati, Balaadithya
http://orcid.org/0000-0001-7524-8850
http://rave.ohiolink.edu/etdc/view?acc_num=dayton1510764485530995

Abstract Details

2017, Master of Science (M.S.), University of Dayton, Electrical Engineering.
In this Thesis, the design and analysis of a mode-matched Disk Resonator Gyroscope (DRG) characterized by high Quality factor exceeding 1 million is presented. The resonator is designed using Micro Electro Mechanical Systems (MEMS) Integrated Design for Inertial Sensors (MIDIS) process offered by Teledyne DALSA Semiconductor Incorporated (TDSI). The MIDIS process offers wafer-level vacuum encapsulation at 10 mTorr and includes Through Silicon Vias(TSVs) that allows flip chip bonding with an integrated circuit for signal detection and processing. Wafer-level encapsulation with ultra-low leak rate is achieved by using MIDIS process, with leak rate as low as 6.58E-18 atm.cm3/s. The DRG design has a circular shape of 600 µm diameter with a single crystal silicon device layer thickness of 40 µm. The designed DRG has a resonant frequency of 277.54 kHz in drive mode and 278.30 kHz in sense mode. The frequency split between drive and sense modes is 760 Hz. A Quality factor of 1.34 million is achieved for the designed DRG.
Vamsy Chodavarapu, Dr. (Committee Chair)
Guru Subramanyam, Dr. (Committee Member)
Weisong Wang, Dr. (Committee Member)
64 p.
Electrical Engineering; Mechanical Engineering
MEMS; gyroscopes; disk resonator gyroscope; MIDIS; vacuum encapsulation; inertial sensors

Recommended Citations

Citations

  • Uppalapati, B. (2017). Design and Analysis of Wafer-Level Vacuum-Encapsulated Disk Resonator Gyroscope Using a Commercial MEMS Process [Master's thesis, University of Dayton]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1510764485530995

    APA Style (7th edition)

  • Uppalapati, Balaadithya. Design and Analysis of Wafer-Level Vacuum-Encapsulated Disk Resonator Gyroscope Using a Commercial MEMS Process . 2017. University of Dayton, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=dayton1510764485530995.

    MLA Style (8th edition)

  • Uppalapati, Balaadithya. "Design and Analysis of Wafer-Level Vacuum-Encapsulated Disk Resonator Gyroscope Using a Commercial MEMS Process ." Master's thesis, University of Dayton, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1510764485530995

    Chicago Manual of Style (17th edition)

dayton1510764485530995
969
© 2017, all rights reserved.
This open access ETD is published by University of Dayton and OhioLINK.