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Phillips Brandon_MS Thesis_FINAL APPROVED VERSION 12-10-2021__final format approved LW 12-13-2021 (1).pdf (2.88 MB)
ETD Abstract Container
Abstract Header
The Design, Fabrication, and Applications of 3D Printed Capacitors
Author Info
Phillips, Brandon Andrew
Permalink:
http://rave.ohiolink.edu/etdc/view?acc_num=dayton1639580306784627
Abstract Details
Year and Degree
2021, Master of Science in Electrical Engineering, University of Dayton, Electrical and Computer Engineering.
Abstract
Over the past decade, Additive Manufacturing (AM) has advanced as a novel manufacturing technique used to develop rapid prototypes for custom and complex geometries and multilayer devices in many different industries. Recent advances in emerging technologies such as dual-extrusion FDM 3D printing, along with newly introduced conductive polymer filament materials, have created the potential to use low-cost, readily available 3D printing methods to fabricate electronic devices on-the-fly in remote environments. This study explores the use of Protopasta conductive filament and various common thermoplastic filament materials (PLA, PP, PC) and an Ultimaker s5 Pro dual-extrusion FDM printer with high-resolution 0.25 mm diameter print nozzles to fabricate a fully-fused 50 mm x 50 mm plate capacitor. A maximum capacitance of 328 pF was measured with a 0.25 mm thick dielectric layer of extruded PLA. This demonstrates a 215% increase in capacitance when compared to measurements for a similar plate capacitor constructed with wrought sheet aluminum (104 pF) using the same dielectric material and thickness. An EVAL-AD5940 impedance analyzer was used to measure the capacitance with PLA, PP, and PC dielectric layers at 1 kHz, 5 kHz, 7.5 kHz, and 10 kHz. From these measurements, the dielectric constant of each material was calculated for a dielectric thickness of 1 mm, as follows: 1 kHz (PLA: 3.00, PP: 2.96, PC: 3.00); 5 kHz (PLA: 2.83, PP: 2.74, PC: 2.83); 7.5 kHz (PLA: 2.82, PP: 2.76, PC: 2.910; and 10 kHz (PLA: 2.39, PP: 2.63, PC: is 2.99).
Committee
Amy Neidhard-Doll, Ph.D., P.E. (Committee Chair)
Carrie Bartsch, Ph.D. (Committee Member)
Guru Subramanyam, Ph.D. (Committee Member)
Vamsy Chodavarapu, Ph.D., P.E. (Committee Member)
Pages
136 p.
Subject Headings
Electrical Engineering
;
Engineering
Keywords
3D printing
;
capacitors
;
dielectric constant
;
FDM
;
dual-extrusion
;
0.25 mm nozzle size
Recommended Citations
Refworks
EndNote
RIS
Mendeley
Citations
Phillips, B. A. (2021).
The Design, Fabrication, and Applications of 3D Printed Capacitors
[Master's thesis, University of Dayton]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1639580306784627
APA Style (7th edition)
Phillips, Brandon.
The Design, Fabrication, and Applications of 3D Printed Capacitors.
2021. University of Dayton, Master's thesis.
OhioLINK Electronic Theses and Dissertations Center
, http://rave.ohiolink.edu/etdc/view?acc_num=dayton1639580306784627.
MLA Style (8th edition)
Phillips, Brandon. "The Design, Fabrication, and Applications of 3D Printed Capacitors." Master's thesis, University of Dayton, 2021. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1639580306784627
Chicago Manual of Style (17th edition)
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Document number:
dayton1639580306784627
Download Count:
705
Copyright Info
© 2021, all rights reserved.
This open access ETD is published by University of Dayton and OhioLINK.