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Emerging Technologies in On-Chip and Off-Chip Interconnection Network

Sikder, Md Ashif Iqbal
http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1469028996

Abstract Details

2016, Master of Science (MS), Ohio University, Electrical Engineering (Engineering and Technology).
The number of processing cores on a chip is increasing with the scaling down of transistors to meet the computation demand. This increase requires a scalable and an energy and latency efficient network to provide a reliable communication between the cores. Traditionally, metallic interconnection networks are used to connect the cores. However, according to the International Technology Roadmap for Semiconductor (ITRS), metallic interconnection networks would not be able to meet the future on-chip communication demands due to the energy and latency constraints. Thus, this thesis focuses on the novel on-chip network designs employing the emerging technologies, such as wireless and optics, to provide a scalable and an energy and latency efficient network. In this thesis, I propose an on-chip network architecture called Optical and Wireless Network-on-Chip (OWN) and extend OWN to construct Reconfigurable Optical and Wireless Network-on-Chip (ROWN) architecture. OWN and R-OWN both leverage the advantages of optics and wireless technologies while circumventing the limitations of these technologies. The end result is that OWN and R-OWN both can provide a maximum of three hops communication between any two cores for a 256 to 1024 core networks. My simulation results with synthetic traffic demonstrate that, for 1024-core architectures, OWN requires 34% more area than hybrid-wireless architectures and 35% less area than hybrid-photonic architectures [1]. In addition, OWN consumes 30% less energy per bit than hybrid-wireless architectures and 14% more energy per bit than hybrid-photonic architectures [1]. Moreover, OWN shows 8% and 28% improvement in saturation throughput compared to hybrid-wireless and metallic architectures respectively [1]. On the other hand, for 256-core architectures, R-OWN requires 3.9% and 12% less area compared to metallic and hybrid-wireless architectures respectively. Additionally, R-OWN consumes 44% and 50% less energy per bit compared to metallic and hybrid-wireless architectures respectively. Furthermore, ROWN shows saturation throughput that is 27% and 31% higher than hybrid-wireless and metallic architectures respectively. Since the number of memory intensive applications is increasing, similar to on-chip communication off-chip memory access is also becoming important. A metallic link is generally used to connect the on-chip components to the off-chip memory element. Because wireless technology shows a better energy efficiency and latency requirement compared to the metallic technology for longer distances, in this thesis, I propose several hybrid-wireless networks to explore the use of wireless technology, as an alternative to the metallic technology, for off-chip memory access. My proposed networks require a maximum of two hops to access the off-chip memory and also significantly reduce both the application execution time and energy per bit for real traffic. My simulation results show that, for a 16-core network, the on-chip and off-chip wireless network requires 11% less execution time and also consumes approximately 79% less energy per packet compared to the baseline metallic architecture.
Avinash Kodi (Advisor)
Jeffrey Dill (Committee Member)
80 p.
Computer Engineering; Electrical Engineering
Network-on-Chip; wireless; photonics; DRAM; Chip Multicore Processor;

Recommended Citations

Citations

  • Sikder, M. A. I. (2016). Emerging Technologies in On-Chip and Off-Chip Interconnection Network [Master's thesis, Ohio University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1469028996

    APA Style (7th edition)

  • Sikder, Md Ashif. Emerging Technologies in On-Chip and Off-Chip Interconnection Network. 2016. Ohio University, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1469028996.

    MLA Style (8th edition)

  • Sikder, Md Ashif. "Emerging Technologies in On-Chip and Off-Chip Interconnection Network." Master's thesis, Ohio University, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ohiou1469028996

    Chicago Manual of Style (17th edition)

ohiou1469028996
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© 2016, all rights reserved.
This open access ETD is published by Ohio University and OhioLINK.