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A Multiscale Finite Element Modeling Approach for Thermal Management in Heterogeneous Integrated Circuits

Bonavita, Peter J
http://rave.ohiolink.edu/etdc/view?acc_num=osu155507820020889

Abstract Details

2019, Master of Science, Ohio State University, Mechanical Engineering.
Modern radio frequency (RF) microsystems are challenged to deliver improved performance across an ever-changing landscape of applications and requirements. As the demand for high-power and high-frequency systems grows, heterogeneous integration of new, high-power compound semiconductor (CS) technologies with existing silicon-based circuitry may lead to a paradigm shift in the field of RF electronics. Intimate integration of high-power technologies leads to increased power densities which forces thermal management considerations to the forefront of design. At the moment, the availability thermal analysis tools for heterogeneously integrated technologies are limited, and thermal considerations are often relegated to the back end of the design cycle. In this work, a multiscale finite element approach is developed for thermal management of heterogeneous integrated circuits. The proposed method is capable of simulating heat flow at multiple length scales using submodeling techniques which incorporate high spatial resolution near the active region while including realistic approximations of global boundary conditions. Thermal simulations are presented here for a device implemented using DARPA’s Diverse Accessible Heterogeneous Integration (DAHI). The device’s thermal behavior is explored for a variety of possible configurations and operating conditions. To better inform future circuit designers, the device’s primary thermal bottlenecks are identified and quantified in terms of their influence on temperatures within the device.
Rebecca Dupaix (Advisor)
Waleed Khalil (Committee Member)
141 p.
Electrical Engineering; Engineering; Mechanical Engineering
heterogeneous integration; thermal; simulation; multiscale; integrated circuit; finite element; submodel

Recommended Citations

Citations

  • Bonavita, P. J. (2019). A Multiscale Finite Element Modeling Approach for Thermal Management in Heterogeneous Integrated Circuits [Master's thesis, Ohio State University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=osu155507820020889

    APA Style (7th edition)

  • Bonavita, Peter. A Multiscale Finite Element Modeling Approach for Thermal Management in Heterogeneous Integrated Circuits. 2019. Ohio State University, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=osu155507820020889.

    MLA Style (8th edition)

  • Bonavita, Peter. "A Multiscale Finite Element Modeling Approach for Thermal Management in Heterogeneous Integrated Circuits." Master's thesis, Ohio State University, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=osu155507820020889

    Chicago Manual of Style (17th edition)

osu155507820020889
851
© 2019, all rights reserved.
This open access ETD is published by The Ohio State University and OhioLINK.