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Ultra-wideband, On-Chip Phased Arrays for Millimeter-wave and Terahertz Applications

Sahin, Seckin
http://orcid.org/0000-0002-3146-9341
http://rave.ohiolink.edu/etdc/view?acc_num=osu1574177160069196

Abstract Details

2019, Doctor of Philosophy, Ohio State University, Electrical and Computer Engineering.
Utility of wireless connectivity has been steadily increasing as broadband internet becomes widely available and having low-cost technology leads to more devices built with Wi-Fi capabilities and sensors. As the traditional radio-frequency (RF) bands (sub 3 GHz) become congested, the mmW band offering vast amount of spectrum, is poised to be the backbone of 5G wireless networks. Particularly, thanks to much smaller wavelengths, antenna-integrated transceivers are viable solutions for the future 5G wireless networks. However, key challenges still remain for on-chip implementation of efficient radiators at such high frequencies. Namely, poor antenna bandwidths, severely low radiation efficiencies, as well as laborious and expensive antenna-transceiver integration (wire bonds, flip-chip, ball grid arrays, etc.) limit the utility of truly-integrated on-chip antennas. To overcome these prevailing obstacles we present an ultra-wideband (UWB), low-profile, high efficiency, tightly-coupled array topology which is adopted from RF-frequency realizations and modified as a multilayered structure suitable for standard micro-fabrication process. Through this work, we show that on-chip radiation efficiency is well above 60% over the entire impedance bandwidth. The proposed array exhibits wideband performance, covering 35-75 GHz, achieving an unprecedented coverage that spans most of the bands allocated for mobile communications. Utilization of low-loss materials in such designs can address the substrate coupling issues and improve the radiation efficiency. Moreover, the structural support and packaging materials that exhibit low loss are indispensable for cost-effective realization of integrated high frequency systems. To effectively address these requirements, polymers are a natural, low-cost choice for structural support and packaging of microchips due to their favorable chemical, thermal, and mechanical properties. However, many polymers have not been studied for mmW and THz applications. In this work, a systematic material characterization is performed and a well-documented source for electrical properties of various polymers is prepared in order to adopt low-loss polymers as structural materials for mmW and THz waveguides, devices, components, and sub-systems. Among the various polymers, SUEX epoxy-based dry film is further incorporated into mmW/THz systems as anti-reflection (AR) coating. We used the well-known Nicolson-Ross-Weir (NRW) approach in a rectangular waveguide environment for the material characterization for mmW and THz bands. For the first time, we also develop a one-port material characterization procedure, which is a broad-band, cost-effective, purely analytical material measurement method. Finally, we develop a novel non-contact characterization method for simultaneous characterization of conventional antenna parameters, including the antenna port input impedance, antenna gain and radiation pattern, without requiring a network analyzer connection to the antenna port. This method treats the test antenna and the network analyzer as a 2-port open-air fixture whose network representation corresponds to the desired antenna parameters. The unknown network parameters of the 2-port open-air are determined via a calibration process, and then related to antenna impedance and gain as a function of frequency. Additionally, the radiation pattern of the test antenna can also be characterized using measured reflection coefficient at the network analyzer port for two offset-short terminations of the test antenna port, while mechanically scanning the test antenna over the desired angular range.
Kubilay Sertel (Advisor)
Niru Nahar (Committee Member)
Fernando Teixeira (Committee Member)
201 p.
Electrical Engineering; Electromagnetics; Electromagnetism
millimeter-wave; terahertz; phased-array; antenna; ultra-wideband; beamforming; 5G; low cost; material characterization; permittivity; loss tangent; non-contact metrology; backscattering method; self-defined calibration; time domain spectroscopy

Recommended Citations

Citations

  • Sahin, S. (2019). Ultra-wideband, On-Chip Phased Arrays for Millimeter-wave and Terahertz Applications [Doctoral dissertation, Ohio State University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=osu1574177160069196

    APA Style (7th edition)

  • Sahin, Seckin. Ultra-wideband, On-Chip Phased Arrays for Millimeter-wave and Terahertz Applications. 2019. Ohio State University, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=osu1574177160069196.

    MLA Style (8th edition)

  • Sahin, Seckin. "Ultra-wideband, On-Chip Phased Arrays for Millimeter-wave and Terahertz Applications." Doctoral dissertation, Ohio State University, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=osu1574177160069196

    Chicago Manual of Style (17th edition)

osu1574177160069196
54
© 2019, all rights reserved.
This open access ETD is published by The Ohio State University and OhioLINK.