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Ultraviolet Bonding of Diamond Abrasive Tools for Lap-Grinding Process

Guo, Lei
http://rave.ohiolink.edu/etdc/view?acc_num=toledo1354572460

Abstract Details

2012, Master of Science in Mechanical Engineering, University of Toledo, Mechanical Engineering.
Different from grinding, the lapping process is always taken place on higher precision machining process at low speed and low pressure. Conventional lapping process is based on a slurry process, abrasive particles mixed with lapping fluid supplied during the process and the abrasives keep rolling and scratching in the working zone. By these actions, the material is removed from the work piece. As known, the lapping efficiency is limited due to the abrasion mechanism that is illustrated as three-body abrasion. In order to improve the lapping efficiency and surface finishing, a novel manufacturing method of lapping plate fabrication is proposed in this research. Since the ultraviolet-curable resin first introduced to industry, the rapid prototyping technology developed significantly and become one of the most important techniques. Recently, researchers studied on the manufacturing of abrasive tools by ultraviolet-curable resin and some promising achievements have been made. Therefore, our idea is typically base on the rapid prototyping technique. By curing the mixture of ultraviolet-curable resin and abrasive particle to fabricate the lapping plate, the grains bonded within the mixture. Thus, the abrasion type during lapping change from three- iv body mechanism to two-body mechanism and the lapping efficiency can be improved then. In this research, the material properties of the ultraviolet-curable resin and mixture are studied. The optimum combination of resin and diamond abrasive is selected. Moreover, in order to see the practical lapping performance, the lapping plate is developed. Based on rigid brittle material lapping experiments, the lapping efficiency and surface finishing is discussed and concluded. At last, two ways to improve the performance of lapping plate is carried out. One of them is based on the influence of abrasive type, and the other one focused on the polymerization of resin and bonding strength of the mixture.
Ioan Marinescu, D. (Committee Chair)
Hongyan Zhang (Committee Member)
Sarit Bhaduri (Committee Member)
91 p.
Mechanical Engineering
Ultraviolet Bonding; Resin; Abrasive Tools; Lapping

Recommended Citations

Citations

  • Guo, L. (2012). Ultraviolet Bonding of Diamond Abrasive Tools for Lap-Grinding Process [Master's thesis, University of Toledo]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1354572460

    APA Style (7th edition)

  • Guo, Lei. Ultraviolet Bonding of Diamond Abrasive Tools for Lap-Grinding Process. 2012. University of Toledo, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=toledo1354572460.

    MLA Style (8th edition)

  • Guo, Lei. "Ultraviolet Bonding of Diamond Abrasive Tools for Lap-Grinding Process." Master's thesis, University of Toledo, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=toledo1354572460

    Chicago Manual of Style (17th edition)

toledo1354572460
976
© 2012, all rights reserved.
This open access ETD is published by University of Toledo and OhioLINK.