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CHARACTERISTICS OF 2-2 POLYIMIDE/PZT COMPOSITE FILMS ON Pt/Si SUBSTRATE

PHATAK, DEEPTI DILIP
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1029338020

Abstract Details

2002, MS, University of Cincinnati, Engineering : Materials Science.
Polymer/Ceramic composite films were fabricated using Polyimide and PZT (90/10) and studied for their physical and electrical properties. The homogeneous and oriented composite films were fabricated by combining a spin deposition technique for polyimide with the novel metal-organic deposition technique for PZT. A RTA furnace was used to sinter the PZT films without damaging the Polyimide to fabricate an alternate PI/PZT layer structure. The effect of unpolymerised polyimide, polymerized polyimide, Pt/Si substrate and heating rate on the orientation of the PZT film was studied. X-ray diffraction and SEM techniques were used to determine the orientation, microstructure development and the thickness of the resulting composite structure. Thermal behavior of polyimide and PZT precursor solution was determined by using Thermogravimetric Analysis and Differential Scanning Calorimetry. Results indicate that use of RTA furnace with a heating rate of 110°C/s, instead of a regular furnace for sintering of the PZT layer, produced oriented PZT layers without damage to the Polyimide layers. Using a polymerized Polyimide film resulted in [111] and [101] oriented PZT film. The dielectric properties and electrical stability of composite films with different number of layers, or with the same number of layers but different fabrication methodology, was investigated. The Composite films were highly resistive as expected, since polyimide itself is very resistive, (volume resistiviy>10 16 ). All the films sintered in the RTA furnace were stable up to field strength 10 4 V/cm. The film capacitance and dielectric properties followed a logarithmic mixing rule. They all exhibited capacitance values of 0.3-0.4 nfarads, greater than polyimide films but smaller than typical PZT films. Very low loss (0.02-0.06) was also observed. Annealing of the composite structure after fabrication resulted in lowering of the loss values in the unannealed samples. The capacitance values were not significantly affected by annealing procedure. The results confirm that oriented polymer/ceramic composite films with useful electrical properties and high voltage stability can be successfully fabricated in a layer configuration using, sequential spin deposition technique and an RTA furnace for sintering.
Dr. Relva Buchanan (Advisor)
127 p.
composite films for packaging application; thin films for capacitor application; polyimide-PZT composite thin films; polymer/ceramic thin films

Recommended Citations

Citations

  • PHATAK, D. D. (2002). CHARACTERISTICS OF 2-2 POLYIMIDE/PZT COMPOSITE FILMS ON Pt/Si SUBSTRATE [Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1029338020

    APA Style (7th edition)

  • PHATAK, DEEPTI. CHARACTERISTICS OF 2-2 POLYIMIDE/PZT COMPOSITE FILMS ON Pt/Si SUBSTRATE. 2002. University of Cincinnati, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1029338020.

    MLA Style (8th edition)

  • PHATAK, DEEPTI. "CHARACTERISTICS OF 2-2 POLYIMIDE/PZT COMPOSITE FILMS ON Pt/Si SUBSTRATE." Master's thesis, University of Cincinnati, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1029338020

    Chicago Manual of Style (17th edition)

ucin1029338020
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© 2002, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.