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ucin1049977754.pdf (3.57 MB)
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Abstract Header
HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE
Author Info
XU, PENG
Permalink:
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754
Abstract Details
Year and Degree
2003, MS, University of Cincinnati, Engineering : Electrical Engineering.
Abstract
In this thesis, design, processing and characterization of a hybrid X-band power amplifier is presented for a vertically interconnected multilayer monolithic microwave (M3) module for phased array antenna applications. The module is processed layer by layer as sub-circuits with each subsequent layer monolithically connected to the previous layer by vertical posts. The power amplifier, which occupies the substrate level of the module, can be realized in various alternate ways. In each case, the design incorporates a silicon wafer as a substrate, MEMS processing technology to machine the substrate and polyimide multilayer circuitry with metal layers to complete the bias and matching networks. Micromachining of a silicon wafer provides a means to implement a hybrid power amplifier with a chip transistor embedded in the substrate with matching and bias networks processed in the ensuing upper layers. An application of this technology will provide extension of the SOI technology to higher frequencies and allow mixed analog RF and digital circuitry to be processed on the same substrate. To demonstrate this technology, a hybrid power amplifier was designed using a chip transistor and incorporating multilayer matching networks.
Committee
Dr. Altan M. Ferendeci (Advisor)
Pages
82 p.
Keywords
wet bulk silicon etching
;
PI2611 polyimide multilayer process
;
MMIC circuit
;
wire bonding
;
on water microwave measurement
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Citations
XU, P. (2003).
HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE
[Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754
APA Style (7th edition)
XU, PENG.
HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE.
2003. University of Cincinnati, Master's thesis.
OhioLINK Electronic Theses and Dissertations Center
, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754.
MLA Style (8th edition)
XU, PENG. "HYBRID X-BAND POWER AMPLIFIER DEVELOPMENT FOR 3D-IC PHASED ARRAY MODULE." Master's thesis, University of Cincinnati, 2003. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1049977754
Chicago Manual of Style (17th edition)
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Document number:
ucin1049977754
Download Count:
1,932
Copyright Info
© 2003, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.