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CONTRIBUTIONS TO THE DEVELOPMENT OF A NOVEL METHOD IN LOW TEMPERATURE BONDING OF SILICON-SILICON AND GLASS-GLASS

PUNNAMARAJU, SRIKOUNDINYA
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1061233859

Abstract Details

2003, MS, University of Cincinnati, Engineering : Electrical Engineering.
This work describes the development of a new low temperature bonding technique for bonding silicon-silicon and thick silicon dioxide-Pyrex glass. Silicon-silicon bonding was achieved at 300 degrees centigrade with intermediate doped silicon dioxide layer (0.5-0.7 microns thick). Pyrex glass was successfully bonded to very thick silicon dioxide (2 microns thick) at 450-500 degrees centigrade. Neither type of bonding is possible with conventional bonding techniques. A novel concept using sodium doped thermal silicon dioxide intermediate layers was utilized for achieving this bonding. Sodium doped silicon dioxide was thermally grown using wet oxidation. A minute quantity of sodium chloride was mixed in deionized water during wet oxidation to dope sodium into the thermally grown oxide. With the application of heat and voltage, the electrostatic force of attraction binds the samples together. Bond strengths in the range of 1-4MPa were achieved. The author worked with silicon dioxides that were all thicker than 0.5 microns. The author explored this new concept (developed earlier at a very cursory level in this lab) and narrowed it to a greater extent. The author also worked on other bonding issues such as Coherent Porous Silicon (CPS) bonding to thick Pyrex glass samples for micro loop heat pipe packaging, metal- metal bonding utilizing intermediate glass layers and direct bonding of two thick glass substrates. The author suggests some solutions to overcome the constraints in bonding the above-mentioned samples. Finally, the author recommends further research in this novel bonding technique and also recommends some modifications to the SUSS MicroTec SB6 bonder.
Dr. H. Thurman Henderson (Advisor)
147 p.
silicon-silicon bonding; glass-glass bonding; low temperature bonding; MEMS; bond strength

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Citations

  • PUNNAMARAJU, S. (2003). CONTRIBUTIONS TO THE DEVELOPMENT OF A NOVEL METHOD IN LOW TEMPERATURE BONDING OF SILICON-SILICON AND GLASS-GLASS [Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1061233859

    APA Style (7th edition)

  • PUNNAMARAJU, SRIKOUNDINYA. CONTRIBUTIONS TO THE DEVELOPMENT OF A NOVEL METHOD IN LOW TEMPERATURE BONDING OF SILICON-SILICON AND GLASS-GLASS. 2003. University of Cincinnati, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1061233859.

    MLA Style (8th edition)

  • PUNNAMARAJU, SRIKOUNDINYA. "CONTRIBUTIONS TO THE DEVELOPMENT OF A NOVEL METHOD IN LOW TEMPERATURE BONDING OF SILICON-SILICON AND GLASS-GLASS." Master's thesis, University of Cincinnati, 2003. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1061233859

    Chicago Manual of Style (17th edition)

ucin1061233859
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© 2003, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.