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BUILT-IN SELF-TEST AND SELF-REPAIR FOR CAPACITIVE MEMS DEVICES

XIONG, XINGGUO
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1123038236

Abstract Details

2005, PhD, University of Cincinnati, Engineering : Computer Engineering.
With the rapid development of MEMS (microelectromechanical system) and its increasing applications to safety-critical applications, MEMS testing and fault-tolerant MEMS design are becoming more and more important. A robust and efficient MEMS testing solution is in urgent need for MEMS commercialization, and yield and reliability are also very important issues for MEMS devices. In this thesis both built-in self-test (BIST) and built-in self-repair (BISR) of capacitive MEMS devices are studied. First, we propose a dual-mode built-in self-test (BIST) technique for capacitive MEMS devices. The BIST technique partitions the fixed (instead of movable) capacitance plates. Due to this partition, the BIST technique can be extended to bulk micromachining and other MEMS technologies. Based on the partition, both sensitivity and symmetry BIST modes can be implemented. Since each of both modes has its own fault coverage, a combination of them ensures a more robust test solution. Based on the dual-mode BIST technique, a built-in self-repair (BISR) technique for comb accelerometer devices is proposed. The device consists of several identical modules. Among them, some are connected as the main device, while others act as redundancy. If any of the working modules is found faulty during BIST, the control circuit will replace it with a good module. In this way, the device can be self-repaired. Electrostatic force can also be used as a powerful tool to compensate the sensitivity loss due to modularized design. The BISR scheme leads to great improvement in device yield as well as its reliability. In order to evaluate the effectiveness of the BISR scheme on yield improvement, a yield model for MEMS redundancy repair is developed. The result demonstrates that a significant yield increase can be achieved for moderate initial yield. The control circuit for the BISR implementation is also discussed. In order to evaluate the reliability enhancement due to redundancy repair, a MEMS reliability model is also developed. Based on the reliability model, we evaluate the MEMS reliability in three different failure mechanisms: fatigue, shock and stiction. Analysis results prove that the BISR design leads to effective reliability enhancement for various failure mechanisms.
Dr. Wen-Ben Jone (Advisor)
137 p.
Microelectromechanical System (MEMS); Built-in Self-test (BIST); Built-in Self-repair (BISR); Yield Analysis; Reliability

Recommended Citations

Citations

  • XIONG, X. (2005). BUILT-IN SELF-TEST AND SELF-REPAIR FOR CAPACITIVE MEMS DEVICES [Doctoral dissertation, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1123038236

    APA Style (7th edition)

  • XIONG, XINGGUO. BUILT-IN SELF-TEST AND SELF-REPAIR FOR CAPACITIVE MEMS DEVICES. 2005. University of Cincinnati, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1123038236.

    MLA Style (8th edition)

  • XIONG, XINGGUO. "BUILT-IN SELF-TEST AND SELF-REPAIR FOR CAPACITIVE MEMS DEVICES." Doctoral dissertation, University of Cincinnati, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1123038236

    Chicago Manual of Style (17th edition)

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This open access ETD is published by University of Cincinnati and OhioLINK.