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Design and Experimental Validation of a Micro-Nano structured Thermal Ground Plane for high-g environments

de Bock, Hendrik Pieter Jacobus
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1367937275

Abstract Details

2013, PhD, University of Cincinnati, Engineering and Applied Science: Mechanical Engineering.
As capabilities and associated power consumption of computers, portable devices, avionics and other electronics systems have risen rapidly over the last decade, chip heat fluxes have risen sharply. The function of the thermal management solution is to provide sufficient low thermal resistance spreading such that the heat generated can be rejected at minimal temperature rise. Heat pipes and vapor chambers are efficient mechanisms for spreading heat as they employ two-phase heat transfer and capillary transport for operation. A limitation of these devices is that their operation capability is affected by body forces, such as gravity. This work describes the relevant physics related to the gravitational dependence of a Thermal Ground Plane(TGP). These relations are developed into a design model for TGPs where a design space is identified for successful operation in high-g force environment. From this evaluation, four factors are identified that require empirical evaluation in order to evaluate design performance. The factors are, the capillary pressure, permeability and thermal conductivity of the wick structure and the evaporator and condenser heat transfer performance. Experiments and methods were designed to evaluate each one of these factors. Using the design model and the empirical inputs, 3cm TGP prototypes were developed for testing. As the thermal conductivity of TGP can be very high, significant effort was put into evaluating the uncertainty of the experimental setup. A TGP prototype was evaluated with effective thermal conductivity in excess of 461 W/m-K, exceeding common solid copper thermal conductivity. The experimental setup was modified for operation on a high-g centrifuge at Air Force Research Laboratory (AFRL). On this centrifuge, the TGP demonstrated operation at a thermal conductivity of 436 W/m-K at 10.5 g’s. This validates that it is feasible to have a vapor chamber operational in a high-g environment, enabling additional application space such as avionics systems. Subsequent work demonstrated 15cm TGP with effective thermal conductivity in excess of 5000 W/m-K.
Frank Gerner, Ph.D. (Committee Chair)
Tao Deng, Ph.D. (Committee Member)
Milind Jog, Ph.D. (Committee Member)
Michael Kazmierczak, Ph.D. (Committee Member)
157 p.
Engineering
thermal; vapor chamber; thermal ground plane; heat pipe; thermodynamics; conduction;

Recommended Citations

Citations

  • de Bock, H. P. J. (2013). Design and Experimental Validation of a Micro-Nano structured Thermal Ground Plane for high-g environments [Doctoral dissertation, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1367937275

    APA Style (7th edition)

  • de Bock, Hendrik. Design and Experimental Validation of a Micro-Nano structured Thermal Ground Plane for high-g environments. 2013. University of Cincinnati, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1367937275.

    MLA Style (8th edition)

  • de Bock, Hendrik. "Design and Experimental Validation of a Micro-Nano structured Thermal Ground Plane for high-g environments." Doctoral dissertation, University of Cincinnati, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1367937275

    Chicago Manual of Style (17th edition)

ucin1367937275
1,022
© , some rights reserved.Creative Commons License Design and Experimental Validation of a Micro-Nano structured Thermal Ground Plane for high-g environments by Hendrik Pieter Jacobus de Bock is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported License. Based on a work at etd.ohiolink.edu.
This open access ETD is published by University of Cincinnati and OhioLINK.