Skip to Main Content
 

Global Search Box

 
 
 
 

Files

File List


6651.pdf (2.76 MB)

ETD Abstract Container

Abstract Header

Numerical Analysis of Thermal Characteristics of a Tablet Computer and its Internal Components

Kattekola, Rajiv
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1378113727

Abstract Details

2013, MS, University of Cincinnati, Engineering and Applied Science: Mechanical Engineering.
This study simulated a 3D model of a tablet device to predict/analyze the temperature distribution inside the device. Temperatures of some specific internal components are also predicted. The tablet device chosen was an Apple iPad 2 and was studied by a teardown process to get the layout and locations of all the components of interest. Power was supplied to the tablet through wall outlet and this power was measured using wires - one end of the wires was used to tap the power lines under specific components, and the other end was supplied to a data acquisition (DAQ) software unit. The DAQ module was connected to a laptop to record power and temperature data when an application is run on the tablet. Most of the component powers were obtained from the experiments and unknown power values were calculated using Goalseek option in Excel. Three workloads - Idle, HD Video Streaming and Skype Video Calling were tested with an emphasis on the latter two workloads. 'Hotspot' locations on the front and back sides of the tablet were obtained, using an IR camera, after performing an initial run on the workloads until the workload reached steady state. Thermocouples were then placed at the Hotspot locations on the outside of the tablet to record temperature data. Thermocouples were placed on the internal components such as SoC (System on Chip) or Processor, PMIC (Power Management Integrated Circuit) and Memory of the tablet to record their temperatures. The numerical model of the tablet was generated in FloTHERM from the dimensions obtained from the teardown. Material properties were assigned to all the components. Power sources were applied to the components that generated heat to correspond to the experimental work. The grid was generated in FloTHERM and the maximum aspect ratio of the mesh was within the acceptable range specified by FloTHERM. Board Conductivity and PMIC sensitivity studies were performed on the tablet for the Skype Video Calling workload for steady-state analysis. 'Monitor points' were placed in the numerical model at locations corresponding to the thermocouple locations for the experiments. Steady-state analysis was performed for the Skype Video Calling workload first was it considered to be the most power consuming workload. Temperature distribution inside the tablet device and temperature values for the internal components were obtained for the model, and were found to be within 2°C of the experimental data for display and skin sides of the tablet, and within 4°C for the internal components. The steady-state analysis was followed by transient analysis to obtain the "spike" in temperatures observed during experiments. The same procedure and settings were used to simulate the other two workloads and the results were satisfactory. This study for three different workloads has helped in understanding the thermal distribution inside a tablet device and was a first step towards contributing to the tablet community.
Urmila Ghia, Ph.D. (Committee Chair)
Kirti Ghia, Ph.D. (Committee Member)
Milind Jog, Ph.D. (Committee Member)
2 p.
Mechanical Engineering
Thermal Characteristics; Tablet Computer; thermal distribution; FloTHERM; Board Conductivity; PMIC

Recommended Citations

Citations

  • Kattekola, R. (2013). Numerical Analysis of Thermal Characteristics of a Tablet Computer and its Internal Components [Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1378113727

    APA Style (7th edition)

  • Kattekola, Rajiv. Numerical Analysis of Thermal Characteristics of a Tablet Computer and its Internal Components. 2013. University of Cincinnati, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1378113727.

    MLA Style (8th edition)

  • Kattekola, Rajiv. "Numerical Analysis of Thermal Characteristics of a Tablet Computer and its Internal Components." Master's thesis, University of Cincinnati, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1378113727

    Chicago Manual of Style (17th edition)

ucin1378113727
1,009
© 2013, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.