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Study of Binding Copper Powders by Electrochemical Deposition

Sharan Kumar, Varun
http://orcid.org/0000-0002-4642-0591
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1471346137

Abstract Details

2016, MS, University of Cincinnati, Engineering and Applied Science: Mechanical Engineering.
Additive manufacturing (AM) is a layer-by-layer manufacturing process that has a wide range of applications. Microparts manufactured by additive manufacturing are gaining prominence over traditional manufacturing methods due to their ability to process a wide range of materials, fabricate complex 3D microstructures and ease of use. AM processes have applications in diverse fields such as aerospace, automotive, medical devices and implants, electronics, and so on for fabricating complex microparts. This work evaluates the feasibility of binding metal powders to enable a novel micro additive manufacturing method based on localized electro-deposition. A single layer of copper powders were glued together with the help of Nickel from the electrolyte as a binder using a completely in-house built CNC stage and controller. Images from scanning electron microscopy (SEM) and Optical microscope along with X-ray spectroscopy studies have shown the gluing of copper powders with Nickel acting as a binder element. Mechanical characterization was done on the glued part and yield strength values were obtained. Further, Taguchi studies have been conducted to investigate the optimal process parameters required for minimum diameter of glued spot, layer thickness and yield strength. Analysis of Variance (ANOVA) and signal-to-noise ratio were used to determine the important levels of process parameters and the results were then experimentally verified. A mathematical model is developed and verified to predict yield strength values of the deposit. Experimental verification of the model was performed using different substrates with the same deposition parameters to verify the substrate effects involved in the predicted hardness value. It was found that the deviations in the film hardness values of deposits on different substrates under the same deposition parameters were within 8% of each other.
Sundaram Murali Meenakshi, Ph.D. (Committee Chair)
Thomas Richard Huston, Ph.D. (Committee Member)
David Thompson, Ph.D. (Committee Member)
102 p.
Mechanical Engineering; Mechanics
Electrodeposition; 3D printing; micro additive manufacturing; localized electrodeposition; film hardness; ANOVA

Recommended Citations

Citations

  • Sharan Kumar, V. (2016). Study of Binding Copper Powders by Electrochemical Deposition [Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1471346137

    APA Style (7th edition)

  • Sharan Kumar, Varun. Study of Binding Copper Powders by Electrochemical Deposition. 2016. University of Cincinnati, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1471346137.

    MLA Style (8th edition)

  • Sharan Kumar, Varun. "Study of Binding Copper Powders by Electrochemical Deposition." Master's thesis, University of Cincinnati, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1471346137

    Chicago Manual of Style (17th edition)

ucin1471346137
249
© 2016, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.