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Investigation of Novel Precursor Routes for Incorporation of Titanium Alloys and Nano- Sized Features into Ceramic-Metallic Composites Formed via the TCON Process

Myers, Kyle M
http://rave.ohiolink.edu/etdc/view?acc_num=ysu1365507702

Abstract Details

2012, Master of Science in Chemistry, Youngstown State University, Department of Chemistry.
Fireline TCON Inc. has developed a technology for the creation of alumina/aluminum interpenetrating phase composites via a reactive metal penetration process. TCON composites are created by immersing silica based ceramic precursors into a reactive molten aluminum or aluminum alloyed melt. The molten aluminum metal reacts with the precursor leaving a near net shape alumina ceramic backbone with aluminum filling in the pores in the composite. The resulting composites have unique mechanical properties that are desired for many applications. The mechanical properties of TCON composites can be tuned for specific applications by varying the precursor material, metal composition, and temperature of reaction. Research has shown that the reactive metal penetration process does work with precursors that are not silica based ceramics. Currently Fireline TCON Inc. only works with silica based precursors that leave undesired aluminum-silicon alloys in the metal phase as the transformation takes place. The aluminum-silicon alloys are created from a reduction of the silicon metal cations in the silica based ceramic. The incorporation of titanium into the metal matrix is a more desired result for Fireline. Several titanium based ceramics were transformed using the TCON process to try and incorporate titanium into the metal phase. In addition, specific type materials were transformed in the TCON process in attempt to manifest a nano-sized interpenetrating phase composite. Current technology at Fireline TCON Inc leaves the resulting composites with particle sizes on the micron scale. A nano-scaled titanium-silicon oxide and a β-alumina-type compound, which already has nano-features, were transformed in the TCON process to investigate if a nano-scaled composite would manifest. All of the samples that were transformed were analyzed using optical microscopy, scanning electron microscopy, energy dispersive spectroscopy and x-ray diffraction. Fireline TCON Inc decided that one of the precursor materials showed enough promising results that this sample was scaled-up to test bars to be tested for mechanical properties. The mechanical properties of this composite are compared to existing metal ceramic composites.
Timothy Wagner, Ph.D. (Advisor)
Matthias Zeller, Ph.D. (Committee Member)
Clovis Linkous, Ph.D. (Committee Member)
Virgil Solomon, Ph.D. (Committee Member)
140 p.
Chemistry; Materials Science
Ceramic-Metallic Composites; Reactive Metal Penetration; Alumina Composites; Spinel Composites

Recommended Citations

Citations

  • Myers, K. M. (2012). Investigation of Novel Precursor Routes for Incorporation of Titanium Alloys and Nano- Sized Features into Ceramic-Metallic Composites Formed via the TCON Process [Master's thesis, Youngstown State University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ysu1365507702

    APA Style (7th edition)

  • Myers, Kyle. Investigation of Novel Precursor Routes for Incorporation of Titanium Alloys and Nano- Sized Features into Ceramic-Metallic Composites Formed via the TCON Process. 2012. Youngstown State University, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ysu1365507702.

    MLA Style (8th edition)

  • Myers, Kyle. "Investigation of Novel Precursor Routes for Incorporation of Titanium Alloys and Nano- Sized Features into Ceramic-Metallic Composites Formed via the TCON Process." Master's thesis, Youngstown State University, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=ysu1365507702

    Chicago Manual of Style (17th edition)

ysu1365507702
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© 2012, all rights reserved.
This open access ETD is published by Youngstown State University and OhioLINK.