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TRADEOFFS BETWEEN PERFORMANCE AND RELIABILITY IN INTEGRATED CIRCUITS

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2019, Doctor of Philosophy, Case Western Reserve University, EECS - Computer Engineering.
The Reliability of the ICs or ASICs was assumed to always exceed the expected life- time of the product. Reliability cannot be ignored as the IC/ASIC industry moves to nano-scale geometries. Integrated Circuit technology (IC) and ASIC in particular were always designed to tradeo between Performance, Cost (Area)Power. The Re- liability of the ICs or ASICs was assumed to always exceed the expected lifetime of the product. Reliability cannot be ignored as the IC industry moves to nano-scale geometries. This paper describes a design methodology to perform tradeo s between Lifetime, Performance, Cost (Area) and Power. The main objective of this paper is to develop a design space exploration method and tools for IC/ASICs driven by lifetime concerns due to Electromigration. Our method applies to both safety based products that require longer lifetime, and also to higher performance products that are frequently replaced.
Christos Papachristou (Committee Chair)
Philip Feng (Committee Member)
Soumyait Mandel (Committee Member)
Francis Merat (Committee Member)
Daniel Saab (Committee Member)
421 p.

Recommended Citations

Citations

  • Weyer, D. J. (2019). TRADEOFFS BETWEEN PERFORMANCE AND RELIABILITY IN INTEGRATED CIRCUITS [Doctoral dissertation, Case Western Reserve University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=case155508829933554

    APA Style (7th edition)

  • Weyer, Daniel. TRADEOFFS BETWEEN PERFORMANCE AND RELIABILITY IN INTEGRATED CIRCUITS. 2019. Case Western Reserve University, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=case155508829933554.

    MLA Style (8th edition)

  • Weyer, Daniel. "TRADEOFFS BETWEEN PERFORMANCE AND RELIABILITY IN INTEGRATED CIRCUITS." Doctoral dissertation, Case Western Reserve University, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=case155508829933554

    Chicago Manual of Style (17th edition)