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A Study of Algorithms Based on Digital Image Correlation for Embedding in a Full-Fiield Displacement Sensor with Subpixel Resolution

Chakinala, Shilpa
http://rave.ohiolink.edu/etdc/view?acc_num=akron1367102631

Abstract Details

2013, Master of Science in Engineering, University of Akron, Electrical Engineering.
Digital image correlation (DIC) is a reliable and inexpensive tool for in-plane full-field displacement and strain measurement of the surface of a structure. In this thesis, the technology needed for an embedded low-cost full-field displacement sensor based on DIC is developed. Full-field displacements are measured with subpixel resolution using a subpixel DIC algorithm. This thesis presents a careful study of three commonly used subpixel DIC algorithms to determine which is most appropriate for embedded implementation. Of the three, the spatial gradient method is chosen for embedded implementation to measure the full-field displacements with subpixel resolution as it gives a good trade-off between accuracy and computation time. A careful design of a fixed-point implementation of the spatial gradient method is conducted, in order to achieve a high computational performance when the method is implemented on an embedded microprocessor module appropriate for use within a sensor. The resulting technology for an embedded low-cost full-field displacement sensor can be easily deployed in field applications. Simulation deformations show that the calculated displacements are accurate to within one-tenth of a pixel for uniaxial tension experiments, provided that displacement gradient under tension is no more than ux = 0.012 pixel/pixel. The technology is demonstrated experimentally for uniaxial tension on a rectangular notched steel specimen; the measured full-field displacement is verified by comparing strains derived from the measured displacement with the strains computed numerically using a finite element simulation. The time taken to calculate the displacement for an eight nodal mesh containing 729 surface points is around 5.8 seconds on the embedded microprocessor module.
Joan Carletta, Dr. (Advisor)
GunJin Yun, Dr. (Advisor)
Arjuna Madanayake, Dr. (Committee Member)
S. I. Hariharan, Dr. (Committee Member)
149 p.
Civil Engineering; Electrical Engineering
Digital image correlation; spatial gradient method; low-cost sensor

Recommended Citations

Citations

  • Chakinala, S. (2013). A Study of Algorithms Based on Digital Image Correlation for Embedding in a Full-Fiield Displacement Sensor with Subpixel Resolution [Master's thesis, University of Akron]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=akron1367102631

    APA Style (7th edition)

  • Chakinala, Shilpa. A Study of Algorithms Based on Digital Image Correlation for Embedding in a Full-Fiield Displacement Sensor with Subpixel Resolution. 2013. University of Akron, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=akron1367102631.

    MLA Style (8th edition)

  • Chakinala, Shilpa. "A Study of Algorithms Based on Digital Image Correlation for Embedding in a Full-Fiield Displacement Sensor with Subpixel Resolution." Master's thesis, University of Akron, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=akron1367102631

    Chicago Manual of Style (17th edition)

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© 2013, all rights reserved.
This open access ETD is published by University of Akron and OhioLINK.