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Characterizations of alloying Cu effect on electrochemical reactions of Al-Cu solid solution alloys

Kim, Youngseok
http://rave.ohiolink.edu/etdc/view?acc_num=osu1143130451

Abstract Details

2006, Doctor of Philosophy, Ohio State University, Materials Science and Engineering.
Copper is a major alloying element for high strength aluminum alloys used in the aerospace industry and is known to have a detrimental effect on localized corrosion. Interplay between Cu-bearing intermetallic particles and the matrix containing at least 1.0 wt % solid solution copper is known to induce pit initiation. But Cu additions to aluminum decrease susceptibility to pit initiation provided that Cu is retained in solid solution. In this study, we show that stimulating alloy dissolution without inducing passive film breakdown significantly ennobles the subsequently measured pitting potential of Al-Cu solid solution alloys. Similar effects are not observed with high purity Al or Al-Zn solid solution alloys. To further investigate the ennobling effect of Cu, metastable pits on high purity Al and Al-Cu solid solution alloys have been examined in detail. Results show that Cu additions decrease the probability of stable pit formation by decreasing metastable pit initiation and growth rates. Surface characterization by scanning transmission electron microscopy and spectral imaging of specially prepared Al-Cu needle-type samples show that Cu is readily enriched at the alloy interface by a range of exposure regimens including those that induce pitting. These results suggest the possibility of local Cu enrichment at incipient pit sites by metastable pitting, which causes ennoblement of the critical pitting potential. In the last part of the study, dissolution kinetics of high purity Al, Al-Mg, and Al-Mg-Cu solid solution alloys are investigated by using an artificial pit electrode cell. It has been determined that Cu ennobles dissolution kinetics of artificial pits for Al-Mg-Cu solid solution.
Rudolph Buchheit (Advisor)
186 p.
aluminu; copper; pitting; TEM; metastable pitting

Recommended Citations

Citations

  • Kim, Y. (2006). Characterizations of alloying Cu effect on electrochemical reactions of Al-Cu solid solution alloys [Doctoral dissertation, Ohio State University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=osu1143130451

    APA Style (7th edition)

  • Kim, Youngseok. Characterizations of alloying Cu effect on electrochemical reactions of Al-Cu solid solution alloys. 2006. Ohio State University, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=osu1143130451.

    MLA Style (8th edition)

  • Kim, Youngseok. "Characterizations of alloying Cu effect on electrochemical reactions of Al-Cu solid solution alloys." Doctoral dissertation, Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=osu1143130451

    Chicago Manual of Style (17th edition)

osu1143130451
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© 2006, all rights reserved.
This open access ETD is published by The Ohio State University and OhioLINK.