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Joint Zone Evolution in Infrared Brazed Ti-6Al-4V with Copper Thin Film

Li, Jr-Hung
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1109186764

Abstract Details

2005, PhD, University of Cincinnati, Engineering : Materials Science.
Joining of Ti-6Al-4V with thin film copper fillers was developed using an active infrared processing technique. The process includes rapid infrared heating of the specimen to 1125°C, and holding at that temperature for 60 seconds in flowing argon without vacuum, then followed by rapid cooling. The copper thin film filler was electroplated to various thicknesses: 1, 2, 4 and 8 µm. Excellent wetting between copper and Ti-6Al-4V was observed in all joints. High joint shear strengths were obtained for all joints. The highest joint strength, 616±10 MPa, was obtained with 2 µm filler thickness. This joint strength is significantly higher than the shear strength of pure copper, 174 MPa, or Ti-6Al-4V, 542 MPa. When the filler material was only 1 µm, the joint zone was not completely filled. X-ray diffraction analysis on the as fractured joint surface revealed the presence of intermetallic compounds when joined with 4 and 8 µm copper fillers but it disappeared when joined with 1 and 2 µm copper fillers. Compositions of the joining zone and the base materials near the joining zone were determined with an energy dispersive spectroscope (EDS) and electron microprobe analysis (EMPA) equipped on the SEM. Also, specimen were joined with 25 µm Cu at 1125°C with various holding time of 0, 60, 120, 180, 240, and 300 seconds to observe the joint zone evolution. The joint evolution follows by melting of Cu filler, dissolution of base materials into Cu liquid, saturation of Cu liquid and isothermal solidification of liquid phase.
Dr. Ray Lin (Advisor)
130 p.
Engineering, Materials Science
Active Infrared processing, Ti-6Al-4V, Joint shear strength, Intermetallic compounds, Joining affected zone, Widmanst&228; tten structure

Recommended Citations

Citations

  • Li, J.-H. (2005). Joint Zone Evolution in Infrared Brazed Ti-6Al-4V with Copper Thin Film [Doctoral dissertation, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1109186764

    APA Style (7th edition)

  • Li, Jr-Hung. Joint Zone Evolution in Infrared Brazed Ti-6Al-4V with Copper Thin Film. 2005. University of Cincinnati, Doctoral dissertation. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1109186764.

    MLA Style (8th edition)

  • Li, Jr-Hung. "Joint Zone Evolution in Infrared Brazed Ti-6Al-4V with Copper Thin Film." Doctoral dissertation, University of Cincinnati, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1109186764

    Chicago Manual of Style (17th edition)

ucin1109186764
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© 2005, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.