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EPOXYLESS FIBER TO SUBMOUNT FIELD ASSISTED BONDING FOR OPTOELECTRONIC APPLICATIONS

BALAGOPAL, AJIT
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1122486732

Abstract Details

2005, MS, University of Cincinnati, Engineering : Electrical Engineering.
A large portion of the cost and turnaround time of most commercial optoelectronic devices is fiber packaging. Reducing the packaging time, elimination of superfluous components and facilitating automation of packaging processes greatly aid in reducing the overall cost of an optoelectronic device. Many new methods are being developed to achieve these varied goals, and this work aims at presenting a new technique to achieve these goals. A new technique for bonding optic fiber directly to silicon or glass submounts for auto-aligned direct fiber attachment, based on field-assisted bonding has been demonstrated. The process is based on the principle of oxide bond formation between metal and glass at high temperatures under the influence of an electric field. Two methods, namely attaching an optic fiber to metallized silicon v-grooves and attaching metal coated fibers to Pyrex v-grooves, have been achieved and bond strengths of over 300g have been demonstrated for both cases. Fibers attached by this method also exhibited a high degree of thermal stability of coupling over a range of 25-80°C. This novel combination of field assisted bonding with appropriately coated fiber on precision fabricated v-grooves eliminates lenses and packaging time, will lead to lower-cost packages, and will facilitate multi-component optical submounts and other novel optoelectronic technology.
David Klotzkin (Advisor)
72 p.
Fiber attachment; Fiber bonding; Anodic bonding; Epoxy bonding; Fiber alignment

Recommended Citations

Citations

  • BALAGOPAL, A. (2005). EPOXYLESS FIBER TO SUBMOUNT FIELD ASSISTED BONDING FOR OPTOELECTRONIC APPLICATIONS [Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1122486732

    APA Style (7th edition)

  • BALAGOPAL, AJIT. EPOXYLESS FIBER TO SUBMOUNT FIELD ASSISTED BONDING FOR OPTOELECTRONIC APPLICATIONS. 2005. University of Cincinnati, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1122486732.

    MLA Style (8th edition)

  • BALAGOPAL, AJIT. "EPOXYLESS FIBER TO SUBMOUNT FIELD ASSISTED BONDING FOR OPTOELECTRONIC APPLICATIONS." Master's thesis, University of Cincinnati, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1122486732

    Chicago Manual of Style (17th edition)

ucin1122486732
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© 2005, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.